Situation
Wafer surface texturing is one of the most important processes for increasing electrical output of a solar cell. Texturing with wet chemical processes is now standard practice. Yet, these chemical processes cause visible impurities like dark stains and lines. GP TEX-Q .Scan precisely detects all contamination and defects on the textured wafer surface. It also checks the texture quality and surface reflection. Wafers with defects or other deviations from classification threshold values are reliably rejected.
Principle
- Optical inspection system
- On-the-fly measurement
Advantages
- Throughput of up to 3600 wafers/hour, with 100% control rate
- Shows long-term process drift
- Central recipe management and “copy-exact” process
- Simple and fast calibration option
- Constant calibration control
Technical Data
Topic |
Description |
Samples to be measured |
- Mono- and multicrystalline wafers - Square or pseudo square - Alkaline or acidic texture |
Wafer size |
100 … 156 mm |
Camera model |
2K / Linescan |
Defect resolution |
80 µm |
Measured features |
Surface reflectance, reflectance variance, separate treatment of reflectance at wafer edges, etch pits |
Maximum belt speed |
400 mm/s |
Minimum cycle time |
1 s |
Machine interface (automation) |
- Parallel I/O - Parallel I/O (combined with RS232 for WaferID info) - Profibus |
Data interface (to factory |
XML via TCP/IP |
Note: All technical details are subject to change without prior notice. Only technical specifications contained in an offer are binding.