Situation
Smooth production flow is invaluable. Preventable downtimes have a direct impact on the efficiency of the entire production line. Wafer breakage during processing is a frequent cause of such production downtimes. GP NANO-D .Scan carefully detects all open and closed microcracks wherever they are on the wafer. This way, the corresponding material is classified and can be separated appropriately, before cracks and microcracks can cause any damage to the production line.
Principle
- Optical control system for incoming or outgoing quality control
- Detection of microcracks based on light dispersion in the cracks
Advantages
- No differentiation between open and closed cracks during measurement
- Helps detect process, handling and transport problems of a solar cell production line
- Increases processing facility operating time and yield
- Central recipe management and "copy-exact" process
- Simple and fast calibration option
Technical Data
Topic |
Description |
Samples to be measured |
- Mono- and multicrystalline as-cut wafers - Square or pseudo square |
Wafer size |
100 … 156 mm |
Camera model |
1K-IR / Linescan |
Minimum defect size |
1 µm / 0.1 µm |
Measured features |
Open and closed microcracks, holes |
Maximum belt speed |
300 mm/s / 200 mm/s |
Minimum cycle time |
1 s |
Machine interface |
- Parallel I/O - Parallel I/O (combined with RS232 for WaferID info) - Profibus |
Data interface (to factory |
XML via TCP/IP |
Note: All technical details are subject to change without prior notice. Only technical specifications contained in an offer are binding.
User Interface
The GP NANO-D .Scan reliably detects all open or closed microcracks. A new illumination technology also makes it possible to differentiate between thermal and mechanical micro-cracks, as well as inclusions. The GP software evaluates and displays each type of defect.
