SITUATION
Every settings adjustment in wafer production directly affects the characteristics of the final products. For optimal further processing, wafers should be sorted into quality classifications. That allows subsequent processes to be adapted to the requirements of each individual wafer.
GP WIS measuring instruments cover all of the parameters needed for wafer classification.
Principle
- Inline vision wafer inspection to check geometry, impurity (surface quality) and chipped edges
- Optical microcrack detection (open and closed microcracks)
- Optical saw mark detection
- Measurement of wafer thickness and TTV, as well as resistivity
- Measurement of charge carrier life
- Mechanical stability test
Advantages
- Central control unit to monitor measuring devices, wafer tracing, measurement data collection and evaluation
- Up to 3000 wafers per hour
- Reliably covers all necessary measurement applications
Technical Data
Topic |
Description |
Standard System |
System consists of - Unstacker (4 stacks) for unstacking from J&R magazines - Testing unit including - Optical geometry, contour and surface control - Contactless thickness and resistivity measurement - 4-Bin box sorte - 4-Bin magazine sorte - Centralized control system (WIS-MES) |
Wafer Size |
125x125 mm², 156x156 mm² |
Wafer Format |
Square or pseudosquare |
Throughput (gross) |
3.000 wafers/hour |
Optional Measurement systems |
- Optical microcrack detection - Lifetime measurement (needs second test unit) - Optical Saw Mark detection (needs second test unit) - Mechanical stability test (needs second test unit) |
Note: All technical details are subject to change without prior notice. Only technical specifications contained in an offer are binding.