Situation
During wafer processing, the groundwork is laid for excellent output and performance of later products. The process of cutting wafers to size creates variations in wafer thickness, the total thickness variation (TTV), as well as surface morphology (warp/bow) and resistivity. This makes inspecting all these factors and wafer classification an indispensable part of quality assurance. WAF INSP TTV is a solid combination of resistivity and thickness measurement in one system.
Principle
- Non-contact measurement “on the fly” or stop-measurement
Advantages
- Simple integration
- No additional handling needed
- 100% control rate
- Throughput of up to 3600 wafers/hour
- Various designs (depending on automation requirements)
Technical Data
Topic |
Description |
Samples to be measured |
- Mono- and multi-crystalline wafers - Square or pseudo square - As-cut, textured or non-textured surface |
Wafer size |
125 … 210 mm |
Measurement spot |
approx. 20 mm diameter |
Measured quantities and measurement range |
|
Wafer thickness |
100 … 500 µm |
TTV |
5… 500 µm |
Specific resistivity |
0.1 … 15 Ohm cm or 0.3 … 25 Ohm cm |
Bow |
> 300 µm |
Interfaces |
|
Machine interface (automation) |
- Parallel I/O - Combined Parallel I/O and RS232 for WaferID info - Profibus |
Data interface (to factory network or automation) |
- OPC (server) - XML via TCP/IP |
Note: All technical details are subject to change without prior notice. Only technical specifications contained in an offer are binding.