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WIS UNIT
Fully integrated wafer inspection system for complete quality control
overview

Situation

In the production of wafers, process parameters directly affect the wafer quality. For optimal use of wafers it is necessary to sort them into appropriate quality classes. This way, further processes can be adjusted according to the characteristics of the wafers.
The fully-integrated WIS UNIT covers all the parameters necessary for wafer classification and reliable quality control.

Principle

  • Inline vision wafer inspection to check geometry, impurity (surface quality) and chippings
  • Optical micro crack detection (open and closed micro cracks)
  • Full-area saw mark detection (independent of orientation)
  • Measurement of wafer thickness and TTV, as well as resistivity
  • Upgradable sorting unit with 8 bins

Advantages

  • About 3600 wafers per hour
  • Central control unit to monitor measuring devices, wafer tracing, measurement data collection and evaluation
  • Robust on-the-fly measurement and handling
  • Reliably covers all necessary measurement applications
  • Intuitive and easy-to-operate machine interface

Technical Data

Topic

Description

Samples to be measured

Monocrystalline wafers
Multicrystalline wafers
Cast-Mono wafers 

Wafer size

156mm, square or pseudosquare

Data interface
(vertical communication)

SECS-II/GEM (SEMI PV2) via TCP/IP for MES connection

Throughput

3600 samples/h

Connections

Electricity (3 Phase, 380 V)
TCP/IP (Data interface)

System dimensions
(W x H x D)

2253 x 2550 x1150 mm

Note: All technical details are subject to change without prior notice. Only technical specifications contained in an offer are binding.